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board level heat sinks all other products, please contact factory for price, deliver y , and minimums. g normally stocked 30 board level power semiconductor heat sinks 217 series surface mount heat sinks d 2 p ak, to-220, sot-223, sol-20
board level heat sinks all other products, please contact factory for price, deliver y , and minimums. g normally stocked 31 board level power semiconductor heat sinks 217 series surface mount heat sinks d 2 p ak, to-220, sol-20
board level heat sinks all other products, please contact factory for price, deliver y , and minimums. g normally stocked 32 board level power semiconductor heat sinks 233 and 236 series self-locking wavesolderable heat sinks to-220
board level heat sinks all other products, please contact factory for price, deliver y , and minimums. g normally stocked 33 board level power semiconductor heat sinks 235 series compact, stress-free labor-saving locking-tab heat sinks height above footprint thermal performance at typical load standard pc board dimensions mounting solderable mounting natural forced p/n in. (mm) in. (mm) configuration t ab options style convection convection 235-85ab g .850 (21.6) 1.000 (25.4) x .500 (12.7) v ert./horiz. no tab clip/mtg hole 40? @ 2w 6.8?/w @ 400 lfm 235-85ab-01 .850 (21.6) 1.000 (25.4) x .500 (12.7) v ertical 01 clip/mtg hole 40? @ 2w 6.8?/w @ 400 lfm 235-85ab-05 .500 (12.7) .850 (21.6) x1.000 (25.4) horizontal 05 clip/mtg hole 40? @ 2w 6.8?/w @ 400 lfm 235-85ab-10 .975 (24.8) 1.000 (25.4) x .500 (12.7) v ertical 10 clip/mtg hole 40? @ 2w 6.8?/w @ 400 lfm material: aluminum, black anodized to-220
board level heat sinks all other products, please contact factory for price, deliver y , and minimums. g normally stocked 34 board level power semiconductor heat sinks 273 series low-cost, low-height wavesolderable heat sinks to-218, to-220
board level heat sinks all other products, please contact factory for price, deliver y , and minimums. g normally stocked 35 board level power semiconductor heat sinks 242 series low-height, low-profile twisted fin heat sinks height above footprint thermal performance at typical load standard pc board dimensions mounting solderable mounting natural forced p/n in. (mm) in. (mm) configuration t ab options style convection convection 242-125ab-22 1.285 (32.6) .875 (22.2) x .250 (6.4) v ertical 22 mtg hole 48 c @ 2w 6.2 c/w @ 400 lfm material: aluminum, black anodized to-220
board level heat sinks all other products, please contact factory for price, deliver y , and minimums. g normally stocked 36 board level heat sinks for to-220, to-218 and m ultiw a tt components 244 series 245 series 246 series low height, slim profile wavesolderable folded fin heat sinks multiw a tt
board level heat sinks all other products, please contact factory for price, deliver y , and minimums. g normally stocked 37 248 series 249 series board level heat sinks for to-220, to-218 and m ultiw a tt components 247 series medium height, deep profile wavesolderable folded fin heat sinks height above footprint thermal performance at typical load standard pc board dimensions mounting solderable natural forced w eight p/n in. (mm) in. (mm) configuration t ab options convection convection lbs. (grams) 247-195ab 1.950 (49.5) 1.900 (48.3) x .950 (24.1) v ert./horiz. no tab 25?@ 4w 2.4?/w @ 400 lfm .0330 (15.10) 247-195ab-50 1.950 (49.5) 1.900 (48.3) x .950 (24.1) v ertical 50 25?@ 4w 2.4?/w @ 400 lfm .0340 (15.60) order speedclip 285sc or 330sc separately . (see 248 series section). material: aluminum, black anodized dimensions: in. (mm) mechanical dimensions low height, medium profile wavesolderable folded fin heat sinks height above footprint thermal performance at typical load standard pc board dimensions mounting solderable natural forced w eight p/n in. (mm) in. (mm) configuration t ab options convection convection lbs. (grams) 248-162ab 1.620 (41.1) 2.000 (50.8) x .750 (19.1) v ert/horiz. no tab 35? @ 4w 2.5?/w @ 400 lfm .026 (11.60) 248-162ab-50 1.620 (41.1) 2.000 (50.8) x .750 (19.1) v ertical 50 35? @ 4w 2.5?/w @ 400 lfm .027 (12.20) order speedclip 285sc or 330sc separately . material: aluminum, black anodized dimensions: in. (mm) order speedclips separatley for use with series 246, 247, 248 or 249 mechanical dimensions medium height, deep profile wavesolderable folded fin heat sinks height above footprint thermal performance at typical load standard pc board dimensions mounting solderable natural forced w eight p/n in. (mm) in. (mm) configuration t ab options convection convection lbs. (grams) 249-113ab 1.130 (28.7) 1.900 (48.3) x .950 (24.1) v ert./horiz, no tab 35?@ 4w 3.29?/w @ 400 lfm .020 (8.90) 249-113ab-50 1.130 (28.7) 1.900 (48.3) x .950 (24.1) v ertical 50 35?@ 4w 3.29?/w @ 400 lfm .021 (9.40) order speedclip 285sc or 330sc separately . (see 248 series section). material: aluminum, black anodized dimensions: in. (mm) mechanical dimensions multiw a tt
board level heat sinks all other products, please contact factory for price, deliver y , and minimums. g normally stocked 38 board level power semiconductor heat sinks 288 series compact wave-solderable low-cost heat sinks height above maximum thermal performance at typical load standard pc board footprint natural forced w eight p/n in. (mm) in. (mm) convection convection lbs. (grams) 288-1ab g 1.250 (31.8) 0.875 (22.2) x 0.215 (5.5) 85 c @ 4w 12?/w @ 200 lfm 0.0057 (2.59) to-220, to-202
board level heat sinks all other products, please contact factory for price, deliver y , and minimums. g normally stocked 39 board level power semiconductor heat sinks 270/272/280 series small footprint low-cost heat sinks to-220, to-202
board level heat sinks all other products, please contact factory for price, deliver y , and minimums. g normally stocked 40 board level power semiconductor heat sinks 250 series high-performance slim profile heat sinks with integral clips multiwatt
board level heat sinks all other products, please contact factory for price, deliver y , and minimums. g normally stocked 41 board level power semiconductor heat sinks 286 series aluminum and copper low-cost wave-solderable heat sinks height above thermal performance at typical load standard pc board maximum footprint natural forced w eight p/n in. (mm) in. (mm) material convection convection lbs. (grams) 286-ab g 1.190 (30.2) 1.000 (25.4) x 0.500 (12.7) aluminum, anodized 58 c @ 4w 7.4 cw @ 200 lfm 0.0085 (3.86) 286-cbt g 1.190 (30.2) 1.000 (25.4) x 0.500 (12.7) copper, black 58 c @ 4w 7.4 cw @ 200 lfm 0.0250 (11.34) 286-ct 1.190 (30.2) 1.000 (25.4) x 0.500 (12.7) copper, tinned 58 c @ 4w 7.4 cw @ 200 lfm 0.0250 (11.34) efficient heat removal at low cost can be achieved by inserting the 286 series directly into pre- drilled circuit boards; scored mounting tabs may be bent after insertion to provide added stabili- t y . the 286 series can be wavesoldered directly to the board. material: 286-ab style (aluminum, black anodized), 286-cbt style (copper, black paint tin tabs), and 286-ct style (copper, tinned). to-220
board level heat sinks all other products, please contact factory for price, deliver y , and minimums. g normally stocked 42 256 series thermal retainers height (less standard mounting tab) w eight p/n in. (mm) material lbs. (grams) 256-dm g 0.190 (4.0) beryllium copper 0.0005 (0.23) to-92
board level heat sinks all other products, please contact factory for price, deliver y , and minimums. g normally stocked 43 board level power semiconductor heat sinks 200 series high-efficiency heat sinks for small metal can power semiconductors a vailable semiconductor heat sink heat sink heat sink natural applicable standard p/n case diameter inside dia. outside dia. height convection forced power & finish min/max ? ? ? case rise convection semiconductor t ypes in. (mm) in. (mm) in. (mm) in. (mm) above ambient ( q ca@200 lfm) case types g 201cb, 201ab 0.161 (4.1)/0.240 (6.1) 0.150 (3.8) 0.640 (16.2) 0.187 (4.8) 65? @ 1w 31?/w to-18, to-24, to-28, 202cb 0.161 (4.1)/0.240 (6.1) 0.150 (3.8) 0.490 (12.5) 0.187 (4.8) 73? @ 1w 43?/w to-40, to-44 203cb 0.161 (4.1)/0.240 (6.1) 0.150 (3.8) 0.640 (16.2) 0.375 (9.5) 53? @ 1w 23?/w 204cb g , 204sb 0.275 (7.0)/0.370 (9.4) 0.255 (6.5) 0.550 (4.8) 0.187 (4.8) 68? @ 1w 35?/w to-5, to-9, to-11, 205cb g , 205sb 0.275 (7.0)/0.370 (9.4) 0.255 (6.5) 0.720 (18.3) 0.187 (4.8) 59? @ 1w 28?/w to-12, to-26, to-29, 205ab, 205ap 0,275 (7.0)/0.370 (9.4) 0.255 (6.5) 0.720 (18.3) 0.187 (4.8) 68? @ 1w 28?/w to-33, to-43, to-45 207cb g , 207sb g 0.275 (7.0)/0.370 (9.4) 0.255 (6,5) 0.720 (18.3) 0.375 (9.5) 46? @ 1w 20?/w 207ab g , 207ap 0.275 (7.0)/0.370 (9.4) 0.255 (6.5) 0.720 (18.3) 0.375 (9.5) 53? @ 1w 20?/w 209cb, 209sb 0.275 (7.0)/0.370 (9.4) 0.255 (6.5) 1.280 (32.5) 0.437 (11.1) 30? @ 1w 13?/w 211cb 0.440 (11.2)/0.544 (13.8) 0.420 (10.7) 0.830 (21.1) 0.187 (4.8) 50? @ 1w 24?/w to-8, to-38 213cb, 213sb 0.440 (11.2)/0.544 (13.8) 0.420 (10.7) 0.830 (21.1) 0.375 (9.5) 44? @ 1w 19?/w 213ab, 213ap 0.440 (11.2)/0.544 (13.8) 0.420 (10.7) 0.830 (21.1) 0.375 (9.5) 51? @ 1w 19?/w 215cb, 215ab 0.440 (11.2)/0.544 (13.8) 0.420 (10.7) 1.400 (35.6) 0.437 (11.1) 28? @ 1w 15?/w 215ap 0.440 (11.2)/0.544 (13.8) 0.420 (10.7) 1.400 (35.6) 0.437 (11.1) 32? @ 1w 15?/w single-level star 201 , 202 , 204 , 205 , 211 series dual-level star 203,207,213 series dual-level sunburst 209, 215 series materials and finishes available for 200 series: cb beryllium cop - per; black ebonol "c" finish sb silver-bearing copper; black ebonol "c" ab aluminum, black anodized ap aluminum, no finish applied natural and forced convection characteristics 258 series thermal links for fused glass diodes diodes
board level heat sinks all other products, please contact factory for price, deliver y , and minimums. g normally stocked 44 board level power semiconductor heat sinks 634 series slim profile unidirectional fin vertical mount heat sink standard height above footprint p/n pc board dimensions w eight plain pin without pin in. (mm) in. (mm) lbs. (grams) 634-10abp g 634-10ab 1.000 (25.4) 0.640 (16.26) x 0.640 (16.26) 0.016 (7.48) 634-15abp 634-15ab 1.500 (38.1) 0.640 (16.26) x 0.640 (16.26) 0.025 (11.21) 634-20abp g 634-20ab 2.000 (50.8) 0.640 (16.26) x 0.640 (16.26) 0.033 (14.95) material: aluminum, black anodized. these slim profile unidirectional fin heat sinks offer users two assembly alternatives for verti - cally mounting to-220 and to-218 components. models are available with or without wave- solderable pins on 0.40 in. (10.2) centers, making them ideal for a variety of applications where quick assembly is needed and space is at a premium. to-220 and to-218

board level heat sinks all other products, please contact factory for price, deliver y , and minimums. g normally stocked 46 626 and 627 series high-efficiency heat sinks for vertical board mounting to-218, to-220
board level heat sinks all other products, please contact factory for price, deliver y , and minimums. g normally stocked 47 board level power semiconductor heat sinks 657 series high-performance notched heat sinks for vertical board mounting to-220, to-247, to-218
board level heat sinks all other products, please contact factory for price, deliver y , and minimums. g normally stocked 48 board level power semiconductor heat sinks 690 series highest efficiency/lowest unit cost heat sinks height above thermal performance at typical load semiconductor standard pc board outline dimensions natural forced mounting w eight p/n in. (mm) in. (mm) convection convection hole pattern lbs. (grams) 690-3b g 1.310 (33.3) 1.860 (47.2)-sq 44 c @ 7.5w 2.0 c/w @ 400 lfm (1) to-3 0.0700 (31.75) 690-66b 1.310 (33.3) 1.860 (47.2)-sq 44 c @ 7.5w 2.0 c/w @ 400 lfm (1) to-66 0.0700 (31.75) 690-220b 1.310 (33.3) 1.860 (47.2)-sq 44 c @ 7.5w 2.0 c/w @ 400 lfm (2) to-220 0.0700 (31.75) material: aluminum, black anodized these low-cost heat sinks provide the most power dissipation at the lowest unit cost and are available in three standard types to mount and cool one to-3 or to-66 metal power semicon - ductor type or two plastic package to-220 power semiconductor types. for higher power semiconductors, the 690 series can dissipate up to 20 watts while maintaining a mounting surface temperature rise above ambient air temperature of no more than 91?. to-3, to-66, to-220
board level heat sinks all other products, please contact factory for price, deliver y , and minimums. g normally stocked 49 board level power semiconductor heat sinks 601 and 603 series low-height heat sinks do-4/do-5 diodes

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